Inventec’s R&D team is constantly looking for improvements in this field. Lead free alternatives, like SAC405, SAC378 and other variations have been introduced over the years. In the past, leaded alloys where the solution to electronic assemblies exposed to extreme temperature changes but due to environmental concerns they have been prohibited to use (with a few exceptions). There is a single panel with traditional components, and the solder side will use the Adhesaive process. When there is no traditional Plug-in component, a solder paste process is used (including single-sided, double-sided or multi-layer boards). Choosing the right alloys for a particular need is key. There is a fundamental difference in the Reflow temperature between the two. The solder paste should be stable over time after deposition on the PCB. Standard Solder Paste Reflow Profile for Kester Paste Containing. Some electronic assemblies have to deal with fast and extreme temperature changes, high temperatures, vibrations or need some resistance to drops. The solder paste should contain 85 to 95 by weight (38 to 67 by volume) solder ball powder. - Less change over time during continuous printing and has a very consistent printing performance. What is the difference between reflow soldering and wave soldering Soldering is. Once the solder paste is applied, place the components on the board. The strength of the solder joint is defined by the mechanical reliability properties of the alloy. What Is Reflow Soldering The Reflow Soldering Process. This allowed us to fine-tune over those years well balanced solder solutions with highly inert flux residues. We were one of the first companies providing halogen-free formulations and to use BONO test to confirm the reliability of our solder products. Inventec targeted from the early days high reliability applications. Most no-clean flux residues after reflow are chemically inert to only some extend and cleaning or in other words, defluxing is an option still not always desired.
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